Title :
On the modelling of interconnection discontinuities
Author_Institution :
VTT Electron., Oulu, Finland
Abstract :
An efficient and simple method of modelling of printed-circuit board (PCB) discontinuities is presented. Based on time-domain measurements and subsequent microwave analysis the method enables the PCB discontinuity S-parameters to be calculated. Then, as black box, they can be incorporated into a circuit simulator in order to carry out the transient analysis of overall digital module. The modelling results of DIN-connector are compared to experimental data and good agreement is reported.
Keywords :
S-parameters; circuit simulation; integrated circuit interconnections; integrated circuit modelling; printed circuits; transient analysis; DIN-connector; PCB discontinuity modelling; S-parameters; circuit simulator; digital module; interconnection discontinuities; printed-circuit board; subsequent microwave analysis; time-domain measurements; transient analysis; Analytical models; Circuit simulation; Frequency; Impedance; Integrated circuit interconnections; Microwave measurements; Scattering parameters; Time domain analysis; Transient analysis; Transmission line theory;
Conference_Titel :
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN :
0-7803-8470-9
DOI :
10.1109/SPI.2004.1409047
