Electrical high speed chip-package characterization comparison of simulation results with component measurement

Author

Miersch, E. ; Gospodinova, M. ; Nan, G. ; Thomas, J. ; Held, J.

Author_Institution

EFM Consulting, Schoenaich, Germany

fYear

2004

fDate

9-12 May 2004

Firstpage

215

Lastpage

218

Abstract

The electrical characteristics of interconnects (signal and power nets) of a given multi-chip package (MCP) had to be determined. MCP-nets are mostly multi drop (multi point) nets (MDNs) with in this case up to 18 terminals. The given clock frequency range is 200MHz to 500MHz. The outer dimensions of the MCP under test (MCP u.t.) are about 11 × 12mm. The goal of the analysis was to find out an appropriate way of modelling for such a complex package including signal as well as power nets. It was also necessary to understand if the MCP multi-port nets can be described as lumped circuits in the given performance range of 200MHz to 500MHz as predicted by the λ/20 - and the t_s > 5t_f - rules for the about 1cm long partial branches of the MDNs.

Keywords

high-speed integrated circuits; integrated circuit interconnections; integrated circuit packaging; multichip modules; multiport networks; 1 cm; 200 to 500 MHz; MCP-nets; component measurement; electrical characteristics; electrical high speed chip-package; integrated circuit interconnects; lumped circuits; multichip package; multidrop nets; multipoint nets; multiport nets; power nets; simulation results; Circuit testing; Clocks; Electric variables; Electric variables measurement; Frequency; Integrated circuit interconnections; Packaging; Semiconductor device measurement; Signal analysis; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on

Print_ISBN

0-7803-8470-9

Type

conf

DOI

10.1109/SPI.2004.1409056

Filename

1409056