• DocumentCode
    2830489
  • Title

    Skutterudites: promising power conversion thermoelectrics

  • Author

    Uher, Ctirad

  • Author_Institution
    Dept. of Phys., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    42
  • Lastpage
    47
  • Abstract
    The past dozen years or so have witnessed a major resurgence of interest in thermoelectrics and specifically in identifying novel, potentially promising materials that might deliver better performance than the existing thermoelectric structures. Among the materials that have generated considerable interest are skutterudites. The open crystal environment of skutterudite compounds typified by the presence of structural voids offers a terrific opportunity to modify the material by inserting foreign species into the voids and thus dramatically alter both electronic and phonon transport. With a judicious choice of the filler species one can prepare both n- and p-type filled skutterudites that display exceptionally high thermoelectric figure of merit ZT in excess of unity in the range of temperatures between 700K-1000K. Filled skutterudites are therefore excellent candidates for thermoelectric power generation applications in the intermediate to high temperature regime of operation. In this paper I will briefly review the progress made in improving the thermoelectric properties of filled skutterudites and point out areas where I believe further improvement is likely to be achieved.
  • Keywords
    crystal structure; thermal conductivity; thermoelectricity; 700 to 1000 K; electronic transport; high thermoelectric figure of merit; open crystal environment; phonon transport; power conversion thermoelectrics; skutterudites; structural voids; thermoelectric structures; Chemical technology; Conducting materials; Crystalline materials; Displays; Phonons; Power conversion; Power generation; Temperature; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287445
  • Filename
    1287445