• DocumentCode
    2832776
  • Title

    Thermally-induced current injection across an npn structure

  • Author

    Hagelstein, Peter ; Kucherov, Yan

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    554
  • Lastpage
    557
  • Abstract
    We present our first results from a new model for analyzing the current and voltage relations of semiconductor thermoelectric structures where the associated spatial structures are on the order of a scattering length. The model derives from a formal solution to the transport equation in the relaxation time approximation, and leads to a nonlocal dependence of current on the temperature, potential and Fermi level. We report here results from this model applied to an idealized model for the emitter region of an n-type thermal diode structure with a p-type separation layer. Our results in the case of thermal diode structures are consistent with a forward current injection mechanism (second-order thermionic emission), where the p-type separation layer now prevents the shorting out of a Fermi level discontinuity.
  • Keywords
    Fermi level; p-n junctions; semiconductor device models; thermally stimulated currents; thermoelectric power; Fermi level; associated spatial structures; emitter region; formal solution; forward current injection mechanism; idealized model; n-type thermal diode structure; nonlocal dependence; npn structure; p-type separation layer; potential; relaxation time approximation; scattering length; second-order thermionic emission; semiconductor thermoelectric structures; temperature; thermally-induced current injection; transport equation; Cities and towns; Contact resistance; Electrical resistance measurement; Equations; Scattering; Semiconductor diodes; Short circuit currents; Thermoelectric devices; Thermoelectricity; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287573
  • Filename
    1287573