DocumentCode :
2834475
Title :
Soldering techniques for the assembly of high power solid-state lasers
Author :
Dolkemeyer, J. ; Funck, M. ; Morasch, V. ; Schnitzler, C. ; Loosen, P.
Author_Institution :
Lehrstuhl fur Technol. Optischer Syst., RWTH Aachen Univ., Aachen, Germany
fYear :
2009
fDate :
14-19 June 2009
Firstpage :
1
Lastpage :
1
Abstract :
Soldering techniques are of increasing interest for the manufacturing of laser systems. High thermal conductance required for effective and long-term-stable cooling of laser components and a low sensibility to environmental influences like temperature changes and humidity are the main reasons to join components by soldering. Compared to conventional mounting techniques, soldering demands highly complex process control. Detailed knowledge about the influence of mechanical stress caused by thermal expansion mismatch is necessary to properly choose not only the process strategy but also the dimensions of the components. This paper reports on the development of soldering techniques for the surface-mounted assembly of laser components such as lenses, mirrors, laser-crystals and nonlinear crystals used for the assembly of a miniaturized marking laser system "MicroSlab".
Keywords :
humidity; soldering; solid lasers; surface mount technology; thermal expansion; long-term-stable cooling; mechanical stress; process control; soldering; solid-state lasers; surface-mounted assembly; thermal conductance; thermal expansion mismatch; Assembly systems; Cooling; Humidity; Laser transitions; Manufacturing; Process control; Soldering; Solid lasers; Temperature sensors; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on
Conference_Location :
Munich
Print_ISBN :
978-1-4244-4079-5
Electronic_ISBN :
978-1-4244-4080-1
Type :
conf
DOI :
10.1109/CLEOE-EQEC.2009.5194646
Filename :
5194646
Link To Document :
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