• DocumentCode
    283512
  • Title

    Heterojunction bipolar transistors using GaInAs/InP

  • Author

    Topham, P.J. ; Griffith, I. ; Riffat, J. ; Good, R.C.

  • Author_Institution
    Plessey Res. (Caswell
  • fYear
    1988
  • fDate
    32443
  • Abstract
    Demonstrates the integration of GaInAs/InP HBTs by the fabrication of a monolithic differential amplifier. The eventual aim of this work is the integration of these HBTs with 1.3/1.55 μm optoelectronic components. The epitaxial material for the HBTs was grown by atmospheric pressure MOCVD onto semi-insulating InP substrates. The wide bandgap emitter and collector were formed from sulphur doped InP, with zinc doped GaInAs forming the base layer. Contact to the base layer was made either by magnesium implantation or by a selective wet-etch. After making contact to the heavily doped region of the collector, the devices were isolated by etching down to the substrate. A schematic diagram of the implanted transistor is shown. Resistors were fabricated at the same time as the transistors by using the epitaxial base layer; these were also isolated by mesa etching. The mesas were then planarised by a layer of polyimide and the process was completed by running an interconnection level of metallisation over this
  • Keywords
    III-V semiconductors; bipolar integrated circuits; differential amplifiers; gallium arsenide; heterojunction bipolar transistors; indium compounds; integrated circuit technology; optical communication equipment; resistors; vapour phase epitaxial growth; 1.3 to 1.55 micron; GaInAs-InP transistors; InP substrates; InP:S-GaInAs:Zn-InP:S; MOCVD; VPE; integration; mesa etching; metallisation; monolithic differential amplifier; polyimide planarisation; semiconductors; wide bandgap emitter;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Heterojunction and Quantym Well Devices: Physics, Engineering and Applications, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    209528