Title :
System in Package. Diagnosis and embedded repair
Author :
Hahanov, Vladimir ; Sushanov, Aleksey ; Stepanova, Yulia ; Gorobets, Alexander
Author_Institution :
Comput. Eng. Fac., Kharkov Nat. Univ. of Radioelectron., Kharkov, Ukraine
Abstract :
Problems of System in Package (SiP), as new constructive generation, modules testing are considered. The method of digital system diagnosis based on the disjunctive normal form, which is represented by fault coverage matrix of test sequences are proposed. The method is focused on embedded service functionality, presented as F-IP modules. Methods for embedded functionality repair are adapted.
Keywords :
circuit testing; embedded systems; fault diagnosis; matrix algebra; system-in-package; F-IP modules; SiP; digital system diagnosis method; embedded repair; embedded service functionality; fault coverage matrix; module testing; system in package; test sequences; Crystals; Digital systems; Field programmable gate arrays; Maintenance engineering; Software; System-on-a-chip; Testing;
Conference_Titel :
Design & Test Symposium (EWDTS), 2010 East-West
Conference_Location :
St. Petersburg
Print_ISBN :
978-1-4244-9555-9
DOI :
10.1109/EWDTS.2010.5742115
