• DocumentCode
    2835958
  • Title

    Signal integrity check by simulation to improve PCB performance

  • Author

    Solanki, Sudarshan D. ; Kumaraswamy, Ravishankar

  • Author_Institution
    Wipro Technol., Bangalore, India
  • fYear
    2003
  • fDate
    18-19 Dec. 2003
  • Firstpage
    69
  • Lastpage
    76
  • Abstract
    Day by day the product cycles are shrinking in order to achieve time to market advantage. The project plans are made based on implicit assumption that the prototype boards will be fully functionally correct and ready for pre-qualification testing and very little change happens from prototype to production board. This has made it imperative that we come up with board designs which are right in first pass itself. Today´s board designs are becoming quite complex due to high speed interfaces and shrinking product dimensions. This paper presents the importance of signal integrity and crosstalk simulation in achieving single pass success for today´s boards. The paper presents a case study of a fairly complex telecom board done by WIPRO. It is also important to note that the signal behaviour predicted by computer aided engineering (CAE) tools pretty well matches the signals captured on the board and hence provides a lot of confidence and reasoning behind doing such exercise.
  • Keywords
    circuit optimisation; circuit simulation; computer aided engineering; crosstalk; printed circuit testing; CAE tools; PCB performance; WIPRO; computer aided engineering; crosstalk simulation; high speed interfaces; prequalification testing; prototype boards; shrinking product dimensions; signal behaviour; signal integrity check; time to market; Cities and towns; Computational modeling; Computer aided engineering; Consumer electronics; Crosstalk; Predictive models; Prototypes; Testing; Time to market; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Interference and Compatibility, 2003. INCEMIC 2003. 8th International Conference on
  • Print_ISBN
    81-900652-1-1
  • Type

    conf

  • DOI
    10.1109/ICEMIC.2003.1287764
  • Filename
    1287764