DocumentCode :
2837096
Title :
Low temperature fabrication of high mobility poly-Ge TFTs on plastic
Author :
Shahrjerdi, D. ; Hekmatshoar, B. ; Mohajerzadeh, S. ; Darbari, S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Tehran Univ., Iran
fYear :
2003
fDate :
9-11 Dec. 2003
Firstpage :
361
Lastpage :
364
Abstract :
Fabrication of depletion-mode poly Ge TFTs with field-effect hole mobility of 120 cm2/V-s on flexible PET substrates is reported. The fabricated TFTs show an ON/OFF ratio of 4×l04. All of the fabrication steps have been done at temperatures as low as 130°C. A recently established stress-assisted copper-induced crystallization technique has been exploited to crystallize the amorphous Ge (a-Ge) layer. Mechanical compressive stress has been applied to the Ge layer by bending the flexible substrate inward. Proper patterning of the a-Ge layer before thermo-mechanical post-treatment alleviates the density of cracks induced in the Ge layer as the main repercussion of the interfacial stress.
Keywords :
amorphous semiconductors; bending; crystallisation; electron beam deposition; elemental semiconductors; germanium; hole mobility; internal stresses; semiconductor growth; semiconductor thin films; surface cracks; thermomechanical treatment; thin film transistors; 130 degC; Ge; amorphous Ge layer; bending; crack density; field-effect hole mobility; flexible PET substrates; high mobility poly-Ge TFT; interfacial stress; low temperature fabrication; mechanical compressive stress; stress-assisted copper-induced crystallization; thermo-mechanical post-treatment; Compressive stress; Crystallization; Displays; Driver circuits; Fabrication; Plastics; Positron emission tomography; Substrates; Temperature; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2003. ICM 2003. Proceedings of the 15th International Conference on
Print_ISBN :
977-05-2010-1
Type :
conf
DOI :
10.1109/ICM.2003.1287834
Filename :
1287834
Link To Document :
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