• DocumentCode
    2838360
  • Title

    Built-In-Self-Test Methodology for Hardwares of Dynamically Reconfigurable Computer

  • Author

    Zhou, Qizhong ; Xie, Yongle ; Fu, Xiaojun ; Chen, Su

  • Author_Institution
    Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2011
  • fDate
    17-18 July 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Aiming at the improvement of dependability of dynamically reconfigurable computers, this paper presents one methodology on Design-For-Testability (DFT) based on Built-In-Self-Test. Test subsystem for computer hardware is composed of micro-processor, co-controller, power/clock module, input/output interface module and display module. Communication module, which provides wired or wireless communication for test subsystem is included in this DFT infrastructure also. By this approach, the self-test and self-diagnosis of hardware circuits can be completed for dynamically reconfigurable computers whose design specifications comply with multiple international DFT standards. Following test tasks, such as functional test to entire board or module(s) on the board under test, interconnection test, internal and external test for a single chip, can be realized. The outline of designing verification system is given also in this paper, and experimental results support the effectiveness of this approach proposed.
  • Keywords
    built-in self test; circuit reliability; clocks; design for testability; microcontrollers; reconfigurable architectures; DFT; board under test; built-in self-test methodology; co-controller; design for testability; display module; dynamically reconfigurable computer dependability; dynamically reconfigurable computer hardware; hardware circuit self-diagnosis; input-output interface module; interconnection test; microprocessor chips; power-clock module; verification system design; Built-in self-test; Clocks; Computers; Discrete Fourier transforms; Field programmable gate arrays; Hardware; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits, Communications and System (PACCS), 2011 Third Pacific-Asia Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4577-0855-8
  • Type

    conf

  • DOI
    10.1109/PACCS.2011.5990281
  • Filename
    5990281