Evaluation of SU8 photo polymer for microwave packaging applications

Author

Kuppireddi, Srinivasa Reddy ; Pamidighantam, Sudhakar ; Janardhana, V. ; Sorasen, Oddvar ; Roy, Jibendu Sekhar ; Kulkarn, R.G.

Author_Institution

Dept. of Inf., Univ. of Oslo, Blindern, Norway

fYear

2012

fDate

12-13 Nov. 2012

Firstpage

1

Lastpage

4

Abstract

Epoxy based photo polymer - SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Waveguide transmission lines are chosen as test vehicles. Transmission lines of lengths up to 10mm are formed on ST-Cut Quartz substrates. The fabricated transmission lines are subjected to wafer level packaging. The measured S-parameter data shows a significant difference prior to and after packaging. Further, the effects due to the packaging are modeled using lumped components and the measured data are validated with simulations in Advanced Design System. The measured and simulated data agree favorably with each other, for both before and after packaging.

Keywords

S-parameters; coplanar waveguides; micromechanical devices; polymers; wafer level packaging; Advanced Design System; RFMEMS; S-parameter measurement; ST-Cut quartz substrate; SU8 photo polymer evaluation; epoxy based photo polymer; lumped component; microwave packaging material; radio frequency microelectromechanical system packaging; slotted coplanar waveguide transmission lines; wafer level packaging; Coplanar waveguides; Packaging; Radio frequency; Silicon; Standards; Substrates; Transmission line measurements; Coplanar Waveguides; Packaging; RFMEMS; SU8;

fLanguage

English

Publisher

ieee

Conference_Titel

NORCHIP, 2012

Conference_Location

Cpenhagen

Print_ISBN

978-1-4673-2221-8

Electronic_ISBN

978-1-4673-2222-5

Type

conf

DOI

10.1109/NORCHP.2012.6403146

Filename

6403146