• DocumentCode
    2839596
  • Title

    Transport and leakage in super-critical thickness strained silicon directly on insulator MOSFETs with strained Si thickness up to 135 nm

  • Author

    Åberg, I. ; Cheng, Z. ; Langdo, T.A. ; Lauer, I. ; Lochtefeld, A. ; Antoniadis, D.A. ; Hoyt, J.L.

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    2005
  • fDate
    3-6 Oct. 2005
  • Firstpage
    24
  • Lastpage
    26
  • Abstract
    In this work, we study both FD- and PD-SSOI with aggressive TSi of up to 135 nm for 14% SSOI (14% Ge equivalent strain). We have demonstrated that mobility in 14% SSOI is independent of the strained Si thickness, even for as grown films 10× thicker than the critical thickness. Off-state current also remains independent of TSi. The successful fabrication of PD-SSOI with electron mobility enhancement maintained at 1.5×, for high channel doping and strained Si thickness up to 135 nm, was also demonstrated, showing promise for thicker film PD-SOI applications.
  • Keywords
    MOSFET; electron mobility; elemental semiconductors; semiconductor doping; semiconductor thin films; silicon; silicon-on-insulator; MOSFET; Si; channel doping; electron mobility enhancement; off-state current; strained Si thickness; strained silicon directly on insulator; super-critical thickness; Capacitive sensors; Electron mobility; Fabrication; Germanium silicon alloys; Insulation; MOSFET circuits; Semiconductor films; Silicon germanium; Silicon on insulator technology; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2005. Proceedings. 2005 IEEE International
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-9212-4
  • Type

    conf

  • DOI
    10.1109/SOI.2005.1563521
  • Filename
    1563521