• DocumentCode
    2841196
  • Title

    Total system power minimization of microprocessors using refrigerated systems for electronic cooling

  • Author

    Park, Won Ho ; McCall, Ron ; Yang, C. K Ken

  • Author_Institution
    Univ. of California, Los Angeles, Los Angeles, CA, USA
  • fYear
    2011
  • fDate
    19-21 Oct. 2011
  • Firstpage
    242
  • Lastpage
    245
  • Abstract
    Power dissipation and thermal problems have become a growing issue for scaled technology. This phenomenon drives the need for advance cooling systems. It is well-known that cooling the operating temperature results in reduced electric power and/or speed gains. Since cooling cost penalizes the total power, a refrigeration system is developed and experimentally tested to demonstrate that cooling the high performance microprocessor can lead to overall system power improvement. A processor that dissipates 175.4W of maximum power with 30% electronic leakage power operating at 97°C is cooled using our refrigeration system. Measurements show that with a minimum refrigeration COP of 2.7, the processor operates with junction temperature <;40°C and offers a 25% total system power reduction over the non-refrigerated design. This experiment is the first demonstration of active cooling that lead reduced total wall power. With an improved compressor that maintains the COP across a broad range of cooling capacity, our analysis shows that at least >;13% of total power is saved across the entire range of processor utilization.
  • Keywords
    cooling; integrated circuit packaging; microprocessor chips; refrigeration; thermal management (packaging); advance cooling systems; compressor; electronic cooling; electronic leakage power; high performance microprocessor; power 175.4 W; power dissipation; refrigeration system; temperature 97 degC; thermal problems; total system power minimization; Cooling; Electronics cooling; Heating; Junctions; Microprocessors; Power systems; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4577-1387-3
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2011.6117155
  • Filename
    6117155