Title :
Transition structures for EBG waveguide-based interconnects
Author :
Suntives, Asanee ; Abhari, Ramesh
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
Abstract :
In this paper, transition structures are investigated for coplanar and 3D integration of EBG-based waveguides. These waveguide-type interconnects find application in modern high-speed/high-frequency system packaging. The design of each transition follows a parametric fullwave simulation scheme to optimize the matching within the widest possible bandwidth.
Keywords :
coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; photonic band gap; waveguide transitions; EBG waveguide-based interconnects; parametric fullwave simulation scheme; system packaging; transition structures; Coplanar waveguides; Dielectric losses; Dielectric substrates; Electromagnetic waveguides; Integrated circuit interconnections; Metamaterials; Microstrip; Periodic structures; Planar waveguides; Waveguide transitions;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563723
