DocumentCode :
2842973
Title :
Study of the Ni-InGaAs alloy as an ohmic contact to the p-type base of InP/InGaAs HBTs
Author :
Mehari, S. ; Gavrilov, A. ; Cohen, Sholom ; Ritter, Daniel
Author_Institution :
Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
fYear :
2012
fDate :
27-30 Aug. 2012
Firstpage :
200
Lastpage :
203
Abstract :
Following the silicide to silicon contact approach, Ni-InGaAs alloy was studied as an ohmic contact to p-type InGaAs. The Schottky barrier height of this system is similar to that of conventional metals such as Ti, but the interface is oxide free. The obtained specific contact resistivity to p-type material was substantially lower than that of standard Pt based metallic contacts. However, if employed for the fabrication of the base contact to HBTs, nickel thickness variations may degrade the performance of the base collector junction.
Keywords :
III-V semiconductors; Schottky barriers; electrical resistivity; gallium arsenide; heterojunction bipolar transistors; indium compounds; ohmic contacts; InP-InGaAs; Schottky barrier height; contact resistivity; ohmic contact; p-type base; Conductivity; Indium gallium arsenide; Indium phosphide; Nickel; Schottky diodes; Silicides; HBT; Ni-InGaAs; TLM; ohmic contacts;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials (IPRM), 2012 International Conference on
Conference_Location :
Santa Barbara, CA
ISSN :
1092-8669
Print_ISBN :
978-1-4673-1725-2
Type :
conf
DOI :
10.1109/ICIPRM.2012.6403357
Filename :
6403357
Link To Document :
بازگشت