• DocumentCode
    2845294
  • Title

    Low-cost 10 Gb/s chip-to-chip optical interconnect

  • Author

    Hashim, Aeffendi ; Bamiedakis, Nikos ; Penty, Richard V. ; White, Ian H.

  • Author_Institution
    Dept. of Eng., Univ. of Cambridge, Cambridge, UK
  • fYear
    2010
  • fDate
    19-23 Sept. 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.
  • Keywords
    optical interconnections; chip-to-chip optical interconnect; component misalignment; conventional electronic manufacturing practice; data transmission; Connectors; Optical device fabrication; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Communication (ECOC), 2010 36th European Conference and Exhibition on
  • Conference_Location
    Torino
  • Print_ISBN
    978-1-4244-8536-9
  • Electronic_ISBN
    978-1-4244-8534-5
  • Type

    conf

  • DOI
    10.1109/ECOC.2010.5621276
  • Filename
    5621276
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2845294