• DocumentCode
    2846802
  • Title

    On the feasibility of an antenna in package with stacked directors

  • Author

    Hamidipour, Abouzar ; Fischer, Alexander ; Maurer, Linus ; Stelzer, Andreas

  • Author_Institution
    Institute for Communications Engineering and RF-Systems, University of Linz, A-4040, Austria
  • fYear
    2012
  • fDate
    17-22 June 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper investigates the feasibility of a gain enhancement technique using stacked directors for antennas in package. A 77-GHz antenna designed for automotive radar applications and a frequency multiplier were integrated in a 6×6mm2 embedded wafer level ball grid array (eWLB) package. The frequency multiplier generates the eighteenth harmonic of its input signal and allows the use of a commercial signal source to characterize the antenna. Parasitic directors were etched on a low-loss 2.54mm thick RT/duroid 5880 LZ laminate by means of photolithography and were mounted on the eWLB package. Theoretical analysis and full electromagnetic simulations were verified against the actual measurements of the antenna radiation beam pattern.
  • Keywords
    Arrays; Electronics packaging; Laminates; MMICs; Microwave antennas; Radar antennas; Antenna in package; MMIC; eWLB; gain enhancement; millimeter-wave; stacked directors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
  • Conference_Location
    Montreal, QC, Canada
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-1085-7
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2012.6258397
  • Filename
    6258397