• DocumentCode
    2848545
  • Title

    Effects of the electric field on Ni-induced crystallization in field-aided lateral crystallization process

  • Author

    Wang, Yuhang ; Wang, Langping ; Tang, Baoyin ; Cho, Duck-Kyun

  • Author_Institution
    National Key Lab. of Adv. Welding Production & Technol., Harbin Inst. of Technol., China
  • fYear
    2005
  • fDate
    30 Aug.-2 Sept. 2005
  • Firstpage
    166
  • Lastpage
    170
  • Abstract
    As a crystallization process, the field-aided lateral crystallization (FALC) technique has some outstanding advantages, such as high crystallization rate and low temperature. In this study, an electric field was directly applied between source and drain areas of H shape patterns using the Mo-W interconnecting layer. The effects of the current density and the electrical field strength on the crystallization behavior were investigated. Such crystallization behaviors are attributed to the coexisting effects of electromigration and potential gradient. In addition, the dependence of the degree of crystallization on the current density was studied and the microstructure crystallized by FALC was compared with the microstructure crystallized by metal induced lateral crystallization (MILC) process.
  • Keywords
    crystal microstructure; crystallisation; current density; electric field gradient; electromigration; interconnections; molybdenum; nickel; tungsten; H shape patterns; Mo-W; Mo-W interconnecting layer; Ni; current density; drain areas; electric field effects; electrical field strength; electromigration effect; field-aided lateral crystallization process; metal induced lateral crystallization process; microstructure crystallization; nickel-induced crystallization; potential gradient effect; source area; Amorphous silicon; Crystal microstructure; Crystallization; Current density; Microwave integrated circuits; Nickel; Semiconductor films; Shape; Temperature; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564612
  • Filename
    1564612