DocumentCode
2848637
Title
A large-scale integration hybrid substrate
Author
Dumesnil, M. ; Schroeder, Jochen
Author_Institution
Fairchild Semiconductor, Palo Alto, CA, USA
Volume
XII
fYear
1969
fDate
19-21 Feb. 1969
Firstpage
66
Lastpage
67
Abstract
Two high-density multichip subsystems utilizing beam lead ICs and multilayer metal technology on large ceramic substrates will be described: a 26-IC dual four-bit arithmetic unit (1" by 2") and a 16 k/b random-access MOS memory (304 ICs) on a 4" by 5" alumina card.
Keywords
Aluminum; Ceramics; Circuit testing; Conductivity; Costs; Dielectric substrates; Glass; Large scale integration; Silicon; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1969 IEEE Internationa
Conference_Location
Philadelphia, PA, USA
Type
conf
DOI
10.1109/ISSCC.1969.1154767
Filename
1154767
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