• DocumentCode
    2848671
  • Title

    Synthesis of undercoat with high temperature and humidity resistance for resistor

  • Author

    Wang, Xiuyu ; Zhang, Zhisheng

  • Author_Institution
    Sch. of Electron. Inf. Eng., Tianjin Univ., China
  • fYear
    2005
  • fDate
    30 Aug.-2 Sept. 2005
  • Firstpage
    245
  • Lastpage
    248
  • Abstract
    Epoxy resin undercoat, with high temperature and humidity resistance, for resistor was prepared by curing of acid anhydride and accelerating of glycol with proper nano-SiO2 added at 80°C. The properties of undercoat prepared were characterized by electrical tests, infrared spectra (IR), thermogravimetric analysis (TGA) and scanning electron microscopy (SEM). The results showed more compact and steady inter-crosslinked network structure was formed in the modified epoxy resins undercoat with nano-SiO2 added, which leaded to the performance of modified epoxy resin undercoat improved greatly. The undercoat with nano-SiO2 2.68wt%, kept for six months at room temperature without flocculating and aggregating, is of good stability. The varying ratio of resistance with such undercoat painted is less than 1% after high temperature and humidity resistance test. In this work, an attempt has been made to prepare undercoat, with high temperature and humidity resistance, for resistor by modifying epoxy resin using nano-SiO2.
  • Keywords
    curing; humidity; infrared spectra; nanostructured materials; polymers; resistors; scanning electron microscopy; silicon compounds; thermal analysis; thermal resistance; 80 C; SEM; SiO2; TGA; acid anhydride curing; electrical tests; epoxy resin undercoat; glycol; high temperature resistance; humidity resistance; infrared spectra; inter-crosslinked network structure; modified epoxy resins; resistor; scanning electron microscopy; thermogravimetric analysis; Acceleration; Curing; Electric resistance; Epoxy resins; Humidity; Infrared spectra; Resistors; Scanning electron microscopy; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564620
  • Filename
    1564620