DocumentCode :
2848880
Title :
The impact of the qual-run requirements of APC on the scheduling performance in semiconductor manufacturing
Author :
Li, Li ; Qiao, Fei
Author_Institution :
Sch. of Electron. & Inf. Eng., Tongji Univ., Shanghai
fYear :
2008
fDate :
23-26 Aug. 2008
Firstpage :
242
Lastpage :
246
Abstract :
This research is motivated by the qual-run requirements of Advance Process Control(APC) opposite setups of scheduling in semiconductor manufacturing. The objective is to analyze the impact of the qual-run requirements of APC on the scheduling performance (e.g. the Total Weighted Tardiness (TWT) and makespan)with a number of experiments. Taking parallel machines for example, we propose an Ant Colony Optimization (ACO) algorithm to reach a satisfactory solution in a reasonable computation time under both scenarios of with or without consideration on the qual-run requirements of APC to do the evaluation. It is shown by the simulation results that the qual-run requirements of APC have important impact on the scheduling performance. The total average improvements on TWT and makespan are 15.38% and 10.21%, respectively, of the ACO solution with consideration on the qual-run requirements of APC comparing to the ACO solution without consideration on the qual-run requirements of APC. In addition, the more scheduled lots and more recipes on one machine, the stronger the impact of the qual-run requirements of APC is.
Keywords :
process control; scheduling; semiconductor device manufacture; advance process control; ant colony optimization algorithm; parallel machine; qual-run requirement; scheduling performance; semiconductor manufacturing; total weighted tardiness; Ant colony optimization; Computational modeling; Concurrent computing; Job shop scheduling; Manufacturing processes; Parallel machines; Performance analysis; Process control; Processor scheduling; Semiconductor device manufacture; ACO; APC; Qual-Run; Scheduling; Semiconductor Manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Automation Science and Engineering, 2008. CASE 2008. IEEE International Conference on
Conference_Location :
Arlington, VA
Print_ISBN :
978-1-4244-2022-3
Electronic_ISBN :
978-1-4244-2023-0
Type :
conf
DOI :
10.1109/COASE.2008.4626542
Filename :
4626542
Link To Document :
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