• DocumentCode
    2849005
  • Title

    An On-Chip Bus modeling and parameter simulation method based on utilization analysis

  • Author

    Shi, Zaifeng ; Li, Yuanqing ; Chen, Xing ; Yao, Suying

  • Author_Institution
    Sch. of Electron. Inf. & Eng., Tianjin Univ., Tianjin, China
  • fYear
    2011
  • fDate
    17-18 Nov. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    It is necessary to estimate the system parameters such as bus utilization and buffer capacity In SoC architecture design. With the increase of complexity of system structure and communication protocol, the estimation becomes harder. The cycle-accurate modeling and simulation for the structure and data stream of On-Chip Bus is an efficient method to obtain the estimate value of above parameters. In this paper, this method is implemented by analyzing a Wishbone bus used in a Video Format Conversion chip, using Simulink. By comparing the simulation result and the pessimistic estimate value, the rationality and high efficiency of this method are verified. This method is suitable for analyzing various interconnecting architectures such as user-defined bus, industrial standard bus, multi-core and multi-bus system.
  • Keywords
    integrated circuit interconnections; parameter estimation; protocols; system-on-chip; SoC architecture design; buffer capacity; bus utilization analysis; communication protocol; cycle-accurate modeling; industrial standard bus interconnecting architecture; multibus interconnecting architecture; multicore interconnecting architecture; on-chip bus modeling; parameter simulation method; pessimistic estimate value; system parameter estimation; system structure complexity; user-defined bus interconnecting architecture; video format conversion chip; wishbone bus analysis; Bus Utilization; First-In-First-Out; On-Chip Bus; Parameter Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2011 International Conference of
  • Conference_Location
    Tianjin
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-1998-1
  • Electronic_ISBN
    Pending
  • Type

    conf

  • DOI
    10.1109/EDSSC.2011.6117580
  • Filename
    6117580