Research on Interfacial Intermetallics Growth Behavior of SnAgCu/Cu Solder Joints under Thermal-shearing Cycling

Author

Jiangang, Zhang ; Jihua, Huang ; Lihua, Qi ; Ye, Wang ; Hua, Zhang

Author_Institution

Sch. of Mater. Sci. & Eng., Beijing Sci. & Technol. Univ.

fYear

2005

fDate

2-2 Sept. 2005

Firstpage

1

Lastpage

5

Abstract

In this paper, the growth behavior of intermetallic compounds (IMCs) at the Sn-3.5Ag-0.5Cu/Cu interface under thermal-shearing cycling from 25degC to 125degC had been investigated. Meanwhile, the IMCs at Sn-3.5Ag-0.5Cu/Cu interface under isothermal aging were applied for comparison. The results show that the scallop-shaped Cu₆Sn ₅ IMC is formed during soldering and then the morphology of IMC changes from scallop-shaped to chunk-shaped and the thickness of IMCs increases with isothermal aging or thermal-shearing cycling. The growth rate of the IMCs increases with the increase of the shearing strain(stress). In addition, accumulative Ag₃Sn IMC is found at the interface under thermal-shearing cycling

Keywords

copper alloys; isothermal transformations; mechanical contact; metallisation; silver alloys; soldering; surface mount technology; thermal stresses; tin alloys; 25 to 125 C; Ag₃Sn; Cu₆Sn₅; SnAgCu:Cu; growth behavior; interfacial intermetallics growth; intermetallic compounds; isothermal aging; solder joints; thermal-shearing cycling; Aging; Copper; Electronic packaging thermal management; Intermetallic; Isothermal processes; Shearing; Soldering; Surface-mount technology; Thermal expansion; Thermal stresses; Sn-Ag-Cu; interface; intermetallic compounds; thermal-shearing cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Conference_Location

Shenzhen

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564725

Filename

1564725