Novel fluorinated polyimides for microelectronics applications

Author

Ge, Z.Y. ; Yin, D.X. ; Liu, J.G. ; Fan, L. ; Yang, S.Y.

Author_Institution

Inst. of Chem., Chinese Acad. of Sci., Beijing, China

fYear

2005

fDate

30 Aug.-2 Sept. 2005

Firstpage

218

Lastpage

220

Abstract

A series of novel fluorinated polyimides were prepared, which could be easily dissolve in many organic solvents to give homogeneous and stable polyimide solution with solid content as high as 35-40 wt.%. The polyimide films obtained by casting the polymer solution followed by thermal imidization exhibited good thermal stability with high glass transition temperature and the temperature at 5% weight loss, and have outstanding mechanical properties. In addition, the fluorinated polyimide have low dielectric constants and dissipation factor, and very low moisture absorption.

Keywords

casting; electronics packaging; glass transition; mechanical properties; moisture; permittivity; polymer films; thermal stability; dielectric constants; dissipation factor; fluorinated polyimides; glass transition temperature; mechanical properties; microelectronic packaging; moisture absorption; organic solvents; polyimide films; polyimide solution; thermal imidization; thermal stability; Casting; Glass; Mechanical factors; Microelectronics; Polyimides; Polymer films; Solids; Solvents; Temperature; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564726

Filename

1564726