Key enabling processes for more-than-moore technologies

The continuation of Moore´s law by conventional complementary metal oxide semiconductor (CMOS) scaling is becoming more and more challenging, requiring huge capital investments. 3D-IC with through-silicon via (TSV) interconnects provides another path towards “More Than Moore” with relatively smaller capital investment. Recent announcements from leading image sensor and memory manufacturers show that 3D-ICs are finally moving into high-volume manufacturing (HVM) putting “More Than Moore” in reality. Wafer bonding is the enabling process technology to make this happen. Two of the key wafer bonding techniques - low temperature fusion bonding as well as temporary bonding and de-bonding are the major subject of this contribution, introducing basic process flows and working principles for their CMOS integration.