Title :
Flip-chip GaAs MMICs for microwave MCM-D applications
Author :
Wadsworth, S.D. ; Buck, B.J. ; Dearn, A.W. ; Warner, D.J. ; Juland, I.D.
Author_Institution :
GEC-Marconi Mater. Technol. Ltd., Towcester, UK
Abstract :
High speed data communications systems increasingly require the use of advanced techniques to reduce size and cost and improve performance. GaAs MMIC technologies for wireless transceiver modules are required to perform low noise and power amplification, switching, mixing and LO functions. The capability of providing passive filtering in MCM-D substrate technology makes this an attractive interconnection medium, and the integration of flip-chip mounted GaAs MMICs can provide a cost-effective solution in module manufacture. Characterisation of the impact of flip-chip mounted GaAs MMIC structures within an MCM-D environment is presented, with a discussion of the relative merits of partitioning system elements between MCM-D and GaAs components. Results from a complete transceiver MMIC function at 5.2 GHz assembled using the GaAs/MCM-D techniques are described, with comparisons made to results achieved using conventional assembly methods
Keywords :
III-V semiconductors; MMIC frequency convertors; MMIC oscillators; MMIC power amplifiers; data communication equipment; flip-chip devices; gallium arsenide; integrated circuit design; integrated circuit packaging; microassembling; mobile radio; multichip modules; transceivers; voltage-controlled oscillators; 5.2 GHz; GaAs; GaAs MMIC power amplifier; GaAs MMIC technology; GaAs MMIC up/down convertor; GaAs components; GaAs/MCM-D techniques; MCM-D environment; MCM-D substrate technology; MMIC LO functions; MMIC low noise amplification; MMIC mixing; MMIC power amplification; MMIC switching; assembly methods; data communications systems; flip-chip GaAs MMICs; flip-chip mounted GaAs MMIC structures; flip-chip mounted GaAs MMICs; interconnection medium; microwave MCM-D applications; module manufacture; on-chip VCO; passive filtering; system cost; system element partitioning; system performance; system size; transceiver MMIC function; wireless transceiver modules; Assembly; Communication switching; Costs; Data communication; Filtering; Gallium arsenide; MMICs; Microwave filters; Passive filters; Transceivers;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670793