• DocumentCode
    2853963
  • Title

    Component-integrated sensors and communication for gentelligent devices

  • Author

    Overmeyer, Ludger ; Rissing, Lutz ; Wurz, Marc C. ; Dumke, Michael ; Franke, Stefan ; Griesbach, Tim ; Belski, Alexander

  • Author_Institution
    Inst. of Transp. & Autom. Technol., Leibniz Univ. Hannover, Hannover, Germany
  • fYear
    2011
  • fDate
    6-9 Dec. 2011
  • Firstpage
    499
  • Lastpage
    503
  • Abstract
    Parts which inherently store data about their fabrication, gain load data during their life cycle, machine components that autonomously monitor themselves and arrange inspections as required will be reality in the Collaborative Research Centre 653. The vision of the CRC 653 `Gentelligent Components in their Lifecycle - Utilisation of Inheritable Component Information in Production Engineering´ is the development of parts which exhibit a physical breakup of device and related information. This paper presents techniques of writing and reading information in the surface zone of mechanically stressed devices, a modular micro sensor concept to measure load during the devices production time and lifecycle as well as communication strategies for data exchange between different components and on component level.
  • Keywords
    inspection; machine components; microsensors; production engineering computing; sensors; Collaborative Research Centre 653; communication strategies; component-integrated sensors; data exchange; gentelligent device communication; inheritable component information; machine components; modular microsensor; production engineering; Magnetic cores; Magnetic sensors; Optical waveguides; Production; Soft magnetic materials; Gentelligent components; data storage; dispensed waveguide; hybrid waveguide; magnetic Mg; modular micro sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
  • Conference_Location
    Singapore
  • ISSN
    2157-3611
  • Print_ISBN
    978-1-4577-0740-7
  • Electronic_ISBN
    2157-3611
  • Type

    conf

  • DOI
    10.1109/IEEM.2011.6117967
  • Filename
    6117967