Impact of MCMs on system performance optimization

Author

Kayssi, A.I. ; Sakallah, K.A. ; Brown, R.B. ; Lomax, R.J. ; Mudge, T.N. ; Huff, T.R.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

Volume

2

fYear

1992

fDate

10-13 May 1992

Firstpage

919

Abstract

Presents a performance model for the University of Michigan MCM (multichip module)-based GaAs microcomputer. The model takes into account architectural as well as MCM packaging considerations such as the chip-to-substrate bonding method, the dielectric constant of the insulator, and the resistivity of the metal conductor. The authors illustrate the use of the model by finding the I-cache size which maximizes the MIPS (millions of instructions per second) rating for given MCM technology parameters

Keywords

III-V semiconductors; microcomputers; multichip modules; packaging; GaAs; MCMs; chip-to-substrate bonding method; dielectric constant; multichip module; packaging considerations; resistivity; system performance optimization; technology parameters; Bonding; Conductivity; Conductors; Dielectric constant; Dielectrics and electrical insulation; Gallium arsenide; Metal-insulator structures; Microcomputers; Packaging; System performance;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0593-0

Type

conf

DOI

10.1109/ISCAS.1992.230071

Filename

230071