Exploration of Power Device Reliability using Compact Device Models and Fast Electro-Thermal Simulation

Author

Bryant, A.T. ; Mawby, P.A. ; Palmer, P.R. ; Santi, E. ; Hudgins, J.L.

Author_Institution

Sch. of Eng., Warwick Univ.

Volume

3

fYear

2006

fDate

8-12 Oct. 2006

Firstpage

1465

Lastpage

1472

Abstract

This paper presents the application of compact IGBT and PIN diode models, including features such as local lifetime control and field-stop technology, to the full electrothermal system simulation of a hybrid electric vehicle converter using a lookup table of device losses. The vehicle converter is simulated with an urban driving cycle (FUDS), used to generate transient device temperature profiles. A methodology is also described to explore the converter reliability using the temperature profile, with techniques from materials fatigue analysis. The effects of ambient temperature, driving style and converter design on converter reliability are also investigated

Keywords

automotive electronics; insulated gate bipolar transistors; p-i-n diodes; power semiconductor devices; semiconductor device models; semiconductor device reliability; thermal stress cracking; PIN diode models; compact IGBT models; compact device models; device losses; electrothermal system simulation; field-stop technology; hybrid electric vehicle converter; local lifetime control; lookup table; materials fatigue analysis; power device reliability; power semiconductor devices; temperature profile; thermal cycling; urban driving cycle; Electrothermal effects; Fatigue; Hybrid electric vehicles; Insulated gate bipolar transistors; Materials reliability; Power system modeling; Power system reliability; Table lookup; Temperature; Vehicle driving; Reliability; compact modeling; electro-thermal simulation; mission profile; power semiconductor devices; rainflow cycle counting; thermal cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2006. 41st IAS Annual Meeting. Conference Record of the 2006 IEEE

Conference_Location

Tampa, FL

ISSN

0197-2618

Print_ISBN

1-4244-0364-2

Electronic_ISBN

0197-2618

Type

conf

DOI

10.1109/IAS.2006.256723

Filename

4025410