DocumentCode
2855151
Title
Total productive maintenance in a semiconductor manufacturing firm: an empirical analysis
Author
Ng, K.C. ; Goh, G.G.G. ; Eze, U.C.
Author_Institution
Infineon Technol., Ayer Keroh, Malaysia
fYear
2011
fDate
6-9 Dec. 2011
Firstpage
829
Lastpage
833
Abstract
Total productive maintenance is claimed to play a key role in improving maintenance and engineering performance in firms. With the use of TPM, manufacturing organizations would be able to reduce wastage and enhance productivity. This study is conducted in a large semiconductor manufacturing firm in Malaysia and analyses the secondary data obtained from the total fabrication monitoring system using paired samples t-test. The results indicate that all the performance measures indicate significant improvements after TPM implementation which lends support to the claim of the effectiveness of TPM. Hence, manufacturing firms need to seriously weigh the pros and cons of TPM implementation and take the necessary steps needed to effectively deploy TPM to enjoy better machine performance rates for increased productivity levels.
Keywords
maintenance engineering; productivity; semiconductor industry; statistical analysis; waste reduction; TPM implementation; empirical analysis; manufacturing organization; paired sample t-test; productivity; semiconductor manufacturing firm; total fabrication monitoring system; total productive maintenance; waste reduction; Availability; Maintenance engineering; Manufacturing; Productivity; Semiconductor device measurement; Throughput; Total productive maintenance; comparison analysis; secondary data analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
Conference_Location
Singapore
ISSN
2157-3611
Print_ISBN
978-1-4577-0740-7
Electronic_ISBN
2157-3611
Type
conf
DOI
10.1109/IEEM.2011.6118032
Filename
6118032
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