• DocumentCode
    2855151
  • Title

    Total productive maintenance in a semiconductor manufacturing firm: an empirical analysis

  • Author

    Ng, K.C. ; Goh, G.G.G. ; Eze, U.C.

  • Author_Institution
    Infineon Technol., Ayer Keroh, Malaysia
  • fYear
    2011
  • fDate
    6-9 Dec. 2011
  • Firstpage
    829
  • Lastpage
    833
  • Abstract
    Total productive maintenance is claimed to play a key role in improving maintenance and engineering performance in firms. With the use of TPM, manufacturing organizations would be able to reduce wastage and enhance productivity. This study is conducted in a large semiconductor manufacturing firm in Malaysia and analyses the secondary data obtained from the total fabrication monitoring system using paired samples t-test. The results indicate that all the performance measures indicate significant improvements after TPM implementation which lends support to the claim of the effectiveness of TPM. Hence, manufacturing firms need to seriously weigh the pros and cons of TPM implementation and take the necessary steps needed to effectively deploy TPM to enjoy better machine performance rates for increased productivity levels.
  • Keywords
    maintenance engineering; productivity; semiconductor industry; statistical analysis; waste reduction; TPM implementation; empirical analysis; manufacturing organization; paired sample t-test; productivity; semiconductor manufacturing firm; total fabrication monitoring system; total productive maintenance; waste reduction; Availability; Maintenance engineering; Manufacturing; Productivity; Semiconductor device measurement; Throughput; Total productive maintenance; comparison analysis; secondary data analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
  • Conference_Location
    Singapore
  • ISSN
    2157-3611
  • Print_ISBN
    978-1-4577-0740-7
  • Electronic_ISBN
    2157-3611
  • Type

    conf

  • DOI
    10.1109/IEEM.2011.6118032
  • Filename
    6118032