DocumentCode :
2857260
Title :
Optimization of multiresponse problems using process capability index for batch manufacturing processes
Author :
Amiri, Amirhossein ; Bashiri, Mahdi ; Mogouie, Hamed
Author_Institution :
Dept. of Ind. Eng., Shahed Univ., Tehran, Iran
fYear :
2011
fDate :
6-9 Dec. 2011
Firstpage :
1446
Lastpage :
1450
Abstract :
In this paper a new method in multi response experimental design is proposed to determine the optimal settings for controllable factors, where the responses are uncorrelated. This method leads to improving the quality characteristic with the lower process capability index (PCI) with more priority. Due to the application of this study in a batch manufacturing and existing of some parts in each treatment, PCI has been computed for each treatment for every initial response. Then an aggregated index (ci) has been computed by TOPSIS based on the calculated signal to noise ratios of PCI´s. Finally the optimal controllable factors have been determined by optimizing a fitted linear regression to the aggregated index and values of controllable factors. The proposed method is illustrated by a real case study in a plastic molding factory. The results show the effectiveness of the proposed method in improving the quality characteristic with the lowest cpk.
Keywords :
Taguchi methods; batch processing (industrial); moulding; plastics industry; process capability analysis; regression analysis; PCI; TOPSIS; aggregated index; batch manufacturing processes; fitted linear regression; multiresponse experimental design; multiresponse problems; optimal controllable factors; optimal settings; optimization; plastic molding factory; process capability index; quality characteristic; signal to noise ratios; Batch production systems; Indexes; Optimization; Plastics; Production facilities; Robustness; Tin; Multiresponse; TOPSIS; Taguchi method; batch manufacturing; process capability index;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2011 IEEE International Conference on
Conference_Location :
Singapore
ISSN :
2157-3611
Print_ISBN :
978-1-4577-0740-7
Electronic_ISBN :
2157-3611
Type :
conf
DOI :
10.1109/IEEM.2011.6118156
Filename :
6118156
Link To Document :
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