DocumentCode
2857730
Title
Defect level prediction of printed circuit board assembly manufacturing based on DPMO metric
Author
Soukup, Radek
Author_Institution
Dept. of Technol. & Meas., Univ. of West Bohemia, Pilsen, Czech Republic
fYear
2011
fDate
8-11 Feb. 2011
Firstpage
1
Lastpage
4
Abstract
Companies in the electronics industry need to plan production test strategy for new products in early design phase even before any designs are actually finalized. This paper presents a defect level prediction tool based on Defects per Million Opportunities (DPMO) metric, which is intended for newly designed printed circuit board assemblies (PCBAs), especially ones determined for automotive industry. Due to this tool is possible to analyze and assess test strategy alternatives by using the estimated defects.
Keywords
assembling; printed circuit design; printed circuit manufacture; printed circuit testing; product design; production planning; production testing; DPMO metric; defect level prediction; defects per million opportunities; electronics industry; printed circuit board assembly manufacturing; product design phase; production test strategy planning; Conferences; Electron devices; DPMO; Printed circuit board; defect level prediction;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices (CDE), 2011 Spanish Conference on
Conference_Location
Palma de Mallorca
Print_ISBN
978-1-4244-7863-7
Type
conf
DOI
10.1109/SCED.2011.5744196
Filename
5744196
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