DocumentCode
2857785
Title
200-gate ECL master-slice LSI
Author
Masaki, A. ; Harada, Y. ; Chiba, T.
Author_Institution
Hitachi Central Research Laboratory, Tokyo, Japan
Volume
XVII
fYear
1974
fDate
15-13 Feb. 1974
Firstpage
62
Lastpage
63
Abstract
A 200-gate ECL master slice LSI suitable for computer mainframe logic will be described. Optimization has resulted in a 1.5-ns loaded delay.2.5-W power dissipation and compatibility with standard ECL components.
Keywords
Delay; Large scale integration; Logic circuits; Packaging; Pins; Power dissipation; Thermal resistance; Voltage; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location
Philadelphia, PA, USA
Type
conf
DOI
10.1109/ISSCC.1974.1155336
Filename
1155336
Link To Document