DocumentCode :
2857818
Title :
Invited: Modern MOS semiconductor processing methods
Author :
Sevin, L.
Author_Institution :
Mostek Corp., Carrollton, TX, USA
Volume :
XVII
fYear :
1974
fDate :
15-13 Feb. 1974
Firstpage :
108
Lastpage :
109
Abstract :
A recently completed 3" MOS-LSI wafer processing facility will be described, including ion implantation, automatic wafer handling, automatic mask allignment and design automation aids. Emphasis will be on techniques useful in LSI design and processing.
Keywords :
Boats; Circuit testing; Costs; Electronic components; Large scale integration; MOSFETs; Manufacturing processes; Marketing and sales; Resists; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1974 IEEE International
Conference_Location :
Philadelphia, PA, USA
Type :
conf
DOI :
10.1109/ISSCC.1974.1155338
Filename :
1155338
Link To Document :
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