• DocumentCode
    2861836
  • Title

    Effect of growth parameters on surface morphology evolution of MOMBE-grown InN

  • Author

    Kuo, Shou-Yi ; Chen, Wei-Chun ; Lai, Fang-I ; Lin, Woei-Tyng ; Hsiao, Chien-Nan

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • fYear
    2011
  • fDate
    21-24 June 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    This work reports on the effects of growth temperature, TMIn flow rate and AlN buffer on InN thin films grown by RF-MOMBE epitaxy system. Structural and surface morphology were analyzed by XRD, FE-SEM, AFM and TEM, respectively. Electrical properties were performed by Hall measurement. While the growth temperature is at 500°C, InN grown directly on sapphire substrate preferred two-dimensional (2D) rather than island (3D) growth. However, the thickness of InN with smooth surface was limited at 50 nm due to residual stress caused by lattice mismatch. Moreover, In segregation was found under high TMIn flow rate condition. With the assistance of low-temperature grown intermediate AlN buffer layer, we can effectively improve the structural and electrical properties of InN. Experimental results indicate that the growth parameters are essential for engineering the growth of indium nitride.
  • Keywords
    X-ray diffraction; aluminium compounds; atomic force microscopy; chemical beam epitaxial growth; indium compounds; substrates; surface morphology; transmission electron microscopy; AFM; AlN; FE-SEM; Hall measurement; InN; RF-MOMBE epitaxy system; TEM; XRD; buffer layer; electrical properties; growth parameters; growth temperature; sapphire substrate; structural morphology; surface morphology evolution; temperature 500 degC; Buffer layers; Morphology; Plasma temperature; Substrates; Surface morphology; Temperature; AlN buffer layer; InN; RF-MOMBE;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2011 IEEE 4th International
  • Conference_Location
    Tao-Yuan
  • ISSN
    2159-3523
  • Print_ISBN
    978-1-4577-0379-9
  • Electronic_ISBN
    2159-3523
  • Type

    conf

  • DOI
    10.1109/INEC.2011.5991696
  • Filename
    5991696