DocumentCode :
2863488
Title :
Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Author :
Kaynak, M. ; Wietstruck, M. ; Zhang, W. ; Drews, J. ; Barth, R. ; Knoll, D. ; Korndorfer, F. ; Scholz, R. ; Schulz, K. ; Wipf, C. ; Tillack, B. ; Kaletta, K. ; Suchodoletz, M.V. ; Zoschke, K. ; Wilke, M. ; Ehrmann, O. ; Ulusoy, A.C. ; Purtova, T. ; Liu, G
Author_Institution :
IHP, Im Technologiepark 25, 15236 Frankfurt Oder, Germany
fYear :
2012
fDate :
17-22 June 2012
Firstpage :
1
Lastpage :
3
Abstract :
This paper presents packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads for frequency tuning at mm-wave frequencies. The developed technique provides easy optimization to maximize the RF performance at the desired frequency without having an effect on the switch mechanics. Insertion loss less than 0.25 dB and isolation better than 20 dB are achieved from 30 to 100 GHz. A glass cap with a silicon frame is used to package the switch. Single-pole-double-throw (SPDT) switches and a 24 – 77 GHz reconfigurable LNA is also demonstrated as a first time implementation of single chip BiCMOS reconfigurable circuit at such high frequencies.
Keywords :
BiCMOS integrated circuits; Glass; Inductors; Insertion loss; Loading; Radio frequency; Silicon; BiCMOS; RFMEMS; microelectromechanical devices; millimeter wave integrated circuits; packaging; switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location :
Montreal, QC, Canada
ISSN :
0149-645X
Print_ISBN :
978-1-4673-1085-7
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2012.6259417
Filename :
6259417
Link To Document :
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