• DocumentCode
    2865157
  • Title

    From planar to trench — Evaluation of ruggedness across various generations of power MOSFETs and implications on in-circuit performance

  • Author

    Shah, Hemal ; Oknaian, Steve ; Persson, Eric ; Huang, Rongjun

  • Author_Institution
    Int. Rectifier Corp., El Segundo, CA, USA
  • fYear
    2011
  • fDate
    6-11 March 2011
  • Firstpage
    485
  • Lastpage
    490
  • Abstract
    In this paper we compare the ruggedness of various generations of power MOSFETs using three criteria - single-pulse avalanche robustness, forward-biased safe-operation-area (FBSOA), and body-diode reverse recovery ruggedness. We observed that the trench-gate FETs are generally inferior to planar-gate counterparts in both FBSOA and avalanche capabilities; however, both trench and planar FETs show comparable performance under certain test conditions. Moreover, the trench FETs evaluated in this study are superior in reverse recovery ruggedness.
  • Keywords
    power MOSFET; FBSOA; body-diode reverse recovery ruggedness; forward- biased safe-operation-area; incircuit performance; power MOSFET; single-pulse avalanche robustness; trench-gate FET; Inductance; Logic gates; MOSFETs; Performance evaluation; Semiconductor optical amplifiers; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2011 Twenty-Sixth Annual IEEE
  • Conference_Location
    Fort Worth, TX
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-8084-5
  • Type

    conf

  • DOI
    10.1109/APEC.2011.5744641
  • Filename
    5744641