DocumentCode
2865610
Title
Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs
Author
Li, Er-Ping ; Liu, En-Xiao
Author_Institution
Department of Electronics and Photonics, Institute of High Performance Computing (IHPC), A*STAR, Singapore, 138632
fYear
2012
fDate
17-22 June 2012
Firstpage
1
Lastpage
3
Abstract
This paper systematically explores the underlying principle of a special domain and modal decomposition approach, and reports its latest advancement in modeling and simulation of multilayer packages and printed circuit boards for signal and power integrity analysis. Simulation results by different numerical techniques encompassed in the domain and modal decomposition approach are compared against those from measurement and full-wave simulation. The special domain and modal decomposition approach, compared with full-wave methods, exhibits faster simulation speed with good accuracy.
Keywords
Finite element methods; Integrated circuit modeling; Mathematical model; Microwave circuits; Nonhomogeneous media; Numerical models; Stripline; domain decomposition; modal decomposition; multilayer power/ground planes; signal and power integrity; vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location
Montreal, QC, Canada
ISSN
0149-645X
Print_ISBN
978-1-4673-1085-7
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2012.6259536
Filename
6259536
Link To Document