• DocumentCode
    2866069
  • Title

    High-frequency characteristics of a via connection

  • Author

    Berral, Raúl Rodríguez ; Mesa, Francisco ; Jackson, David R.

  • Author_Institution
    Dept. of Applied Physics 1, University of Seville, Avda. Reina Mercedes s/n, 41012, Spain
  • fYear
    2012
  • fDate
    17-22 June 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The high-frequency characteristics of a via connection that connects two infinite microstrip lines on either side of a ground plane is examined. The assumption of infinite lines allows for a semi-analytical solution, where the lines are treated essentially in closed form. This results in an accurate solution that captures all of the physics of high-frequency wave excitation on the lines by the via. The scattering parameters of the via can be obtained from this solution, which account for radiation and high frequency effects such as leaky-wave excitation.
  • Keywords
    Apertures; Geometry; Microstrip; Scattering parameters; Substrates; Surface waves; Via; discontinuity; interconnect; leaky-waves; microstrip; scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
  • Conference_Location
    Montreal, QC, Canada
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-1085-7
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2012.6259563
  • Filename
    6259563