DocumentCode
2866069
Title
High-frequency characteristics of a via connection
Author
Berral, Raúl Rodríguez ; Mesa, Francisco ; Jackson, David R.
Author_Institution
Dept. of Applied Physics 1, University of Seville, Avda. Reina Mercedes s/n, 41012, Spain
fYear
2012
fDate
17-22 June 2012
Firstpage
1
Lastpage
3
Abstract
The high-frequency characteristics of a via connection that connects two infinite microstrip lines on either side of a ground plane is examined. The assumption of infinite lines allows for a semi-analytical solution, where the lines are treated essentially in closed form. This results in an accurate solution that captures all of the physics of high-frequency wave excitation on the lines by the via. The scattering parameters of the via can be obtained from this solution, which account for radiation and high frequency effects such as leaky-wave excitation.
Keywords
Apertures; Geometry; Microstrip; Scattering parameters; Substrates; Surface waves; Via; discontinuity; interconnect; leaky-waves; microstrip; scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location
Montreal, QC, Canada
ISSN
0149-645X
Print_ISBN
978-1-4673-1085-7
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2012.6259563
Filename
6259563
Link To Document