DocumentCode :
287229
Title :
Second breakdown and latch-up behavior of IGBTs
Author :
Heumann, K. ; Quenum, M.
Author_Institution :
Tech. Univ. Berlin, Germany
fYear :
1993
fDate :
13-16 Sep 1993
Firstpage :
301
Abstract :
The semiconductor structure of bipolar transistors can cause failures by second breakdown. Also power MOSFETs and new semiconductor devices like IGBTs with a parasitic npn-structure may be damaged by this mechanism. First generation IGBTs with a parasitic thyristor inside the device are susceptible to the phenomenon of latch-up. Advances in technology improve the device characteristics. Modern IGBTs seem to show no latch-up despite the existing parasitic thyristor in their structure. This paper gives a short discussion of latch-up and second breakdown phenomena. IGBT of different semiconductor generations during latch-up under various conditions were investigated. A test circuit for these measurements is proposed
Keywords :
electric breakdown of solids; insulated gate bipolar transistors; semiconductor device testing; IGBTs; latch-up behavior; parasitic npn-structure; parasitic thyristor; second breakdown; semiconductor structure; test circuit;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Power Electronics and Applications, 1993., Fifth European Conference on
Conference_Location :
Brighton
Type :
conf
Filename :
264939
Link To Document :
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