• DocumentCode
    287229
  • Title

    Second breakdown and latch-up behavior of IGBTs

  • Author

    Heumann, K. ; Quenum, M.

  • Author_Institution
    Tech. Univ. Berlin, Germany
  • fYear
    1993
  • fDate
    13-16 Sep 1993
  • Firstpage
    301
  • Abstract
    The semiconductor structure of bipolar transistors can cause failures by second breakdown. Also power MOSFETs and new semiconductor devices like IGBTs with a parasitic npn-structure may be damaged by this mechanism. First generation IGBTs with a parasitic thyristor inside the device are susceptible to the phenomenon of latch-up. Advances in technology improve the device characteristics. Modern IGBTs seem to show no latch-up despite the existing parasitic thyristor in their structure. This paper gives a short discussion of latch-up and second breakdown phenomena. IGBT of different semiconductor generations during latch-up under various conditions were investigated. A test circuit for these measurements is proposed
  • Keywords
    electric breakdown of solids; insulated gate bipolar transistors; semiconductor device testing; IGBTs; latch-up behavior; parasitic npn-structure; parasitic thyristor; second breakdown; semiconductor structure; test circuit;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Power Electronics and Applications, 1993., Fifth European Conference on
  • Conference_Location
    Brighton
  • Type

    conf

  • Filename
    264939