DocumentCode
287326
Title
Technology for manufacture of integrated planar LC structures for power electronic applications
Author
Smit, M.C. ; Ferreira, J.A. ; van Wyk, J.D. ; Ehsani, M.
Author_Institution
Rand Afrikaans Univ., Johannesburg, South Africa
fYear
1993
fDate
13-16 Sep 1993
Firstpage
173
Abstract
A new approach to the manufacture of electromagnetic integrated reactive components is presented. In this paper an analysis based on transmission line equations is applied to the planar LC structures and a complete thermal analysis is included. Details of practical technology for integrated planar LC structures operating at high power levels are presented
Keywords
electromagnetic devices; ferrite applications; losses; packaging; power electronics; power integrated circuits; thermal analysis; transmission line theory; DC conduction losses; capacitance; electromagnetic integrated reactive components; inductance; integrated planar LC structures; manufacture; power electronic applications; thermal analysis; transmission line equations;
fLanguage
English
Publisher
iet
Conference_Titel
Power Electronics and Applications, 1993., Fifth European Conference on
Conference_Location
Brighton
Type
conf
Filename
265042
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