• DocumentCode
    2873537
  • Title

    A micromachined Pirani gauge with dual heat sinks

  • Author

    Chae, Junseok ; Stark, Brian H. ; Najafi, Khalil

  • Author_Institution
    Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    532
  • Lastpage
    535
  • Abstract
    This paper reports a micromachined Pirani gauge with dual heat sinks, which can be integrated with MEMS devices inside a vacuum package to monitor long-term pressure changes and stability inside the package. The gauge utilizes small gaps (<1 μm) between its heater and two thermal sinks to obtain large dynamic range (20 mTorr to 2 Torr) and high sensitivity (3.5×105 (K/W)/Torr). This gauge can resolve leak rates inside a small sealed cavity as low as 3×10-16 cm3/sec.
  • Keywords
    electronics packaging; heat sinks; microsensors; pressure measurement; pressure sensors; sensitivity; vacuum gauges; 20 mtorr to 2 torr; MEMS devices; heat sinks; heater; micromachined Pirani gauge; pressure sensors; sensitivity; thermal sinks; vacuum package; Dynamic range; Electronic packaging thermal management; Heat sinks; Heat transfer; Microelectromechanical devices; Sensor phenomena and characterization; Solids; Testing; Thermal conductivity; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
  • Print_ISBN
    0-7803-8265-X
  • Type

    conf

  • DOI
    10.1109/MEMS.2004.1290639
  • Filename
    1290639
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2873537