Title :
Localized induction heating solder bonding for wafer level MEMS packaging
Author :
Yang, Hsueh-An ; Wu, Mingching ; Fang, Weileun
Author_Institution :
Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
This paper reports a new solder bonding method for the wafer level packaging of MEMS devices. The electroplated magnetic film was heated up using the induction heating, and leaded to solder reflow. It took only several seconds to complete the solder reflow and bonding process. The measurement results showed that the temperature of device region was only 110°C during heating. Due to the solder reflow and electroplating technique, hermetic seal of the packaged device is achieved. The bonding strength is up to 18 MPa. In addition, the electroplated thick film also performed as a spacer. In applications, the integration the MUMPs devices with the proposed packaging techniques were demonstrated.
Keywords :
MUMPS; bonding processes; electronics packaging; electroplated coatings; induction heating; magnetic thin films; micromechanical devices; reflow soldering; wafer bonding; 110 degC; MEMS devices; MUMP devices; bonding strength; electroplated magnetic film; electroplated thick film; electroplating; induction heating; multiple user multiple programming system; solder bonding process; solder reflow; spacer; wafer level MEMS packaging; Bonding processes; Heating; Lead; Magnetic films; Microelectromechanical devices; Micromechanical devices; Packaging; Temperature; Wafer bonding; Wafer scale integration;
Conference_Titel :
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN :
0-7803-8265-X
DOI :
10.1109/MEMS.2004.1290688
