DocumentCode
2875751
Title
The product-process-market path: new road maps
Author
Bachmann, Albert E J
Author_Institution
Florida Inst. of Technol., Melbourne, FL, USA
fYear
1991
fDate
27-31 Oct 1991
Firstpage
235
Lastpage
237
Abstract
Global competition is causing management to rethink the way design and production are done. To cut time to market, industry is aiming to shorten both the manufacturing and engineering cycles. New road maps are being developed and experimented with. It is noted that the traditional throw-it-over-the-wall road map has been discarded and the focus has turned to group technology, concurrent engineering, design for manufacture, and design for assembly. Dictaphone Corporation´s products aim at the industrial voice recording market, and in late 1990 it formed a team to explore the feasibility of a new product. The team sized up the proposed product´s technical feasibility by reviewing Dictaphone´s analog/digital technology, PCB (printed circuit board) product process technology, and test requirements. The focus of the case study described is on PCB technology, the PCB being a component of the new product. The concept-design-production path is described. The PCB design-manufacture approach described here provides a road map aimed at product reliability and robustness as well as reduced cycle time, all of which means an improved competitive edge in the market place
Keywords
design engineering; manufacturing industries; research and development management; PCB; R&D; assembly; cycle time; design; engineering cycles; management; manufacturing industries; marketing; printed circuit board; product development; production; reliability; research; robustness; time to market; voice recording; Assembly; Circuit testing; Concurrent engineering; Group technology; Manufacturing industries; Printed circuits; Production; Roads; Robustness; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Technology Management : the New International Language
Conference_Location
Portland, OR
Print_ISBN
0-7803-0161-7
Type
conf
DOI
10.1109/PICMET.1991.183622
Filename
183622
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