Multivariate moment matching for generating boundary condition independent compact dynamic thermal networks of packages [BGA example]

Author

Codecasa, Lorenzo ; D´Amore, Dario ; Maffezzoni, Paolo

Author_Institution

Dipt. di Elettronica e Informazione, Politecnico di Milano, Milan, Italy

fYear

2005

fDate

15-17 March 2005

Firstpage

175

Lastpage

181

Abstract

A novel approach is proposed for generating compact dynamic thermal models of packages, independent of boundary conditions. This approach is based on the novel definition of Robin´s boundary condition independent dynamic thermal network and on the application of a novel multivariate moment matching method. The resulting compact thermal models are more accurate than compact models obtained by means of previous methods.

Keywords

Galerkin method; ball grid arrays; integrated circuit modelling; integrated circuit packaging; method of moments; multivariable systems; thermal management (packaging); BGA packages; Galerkin method; Robin dynamic thermal networks; boundary condition independence; multivariate moment matching; package compact dynamic thermal networks; thermal models; Boundary conditions; Capacitance; Disruption tolerant networking; Electronic mail; Equations; Moment methods; Network topology; Packaging; Partitioning algorithms; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8985-9

Type

conf

DOI

10.1109/STHERM.2005.1412175

Filename

1412175