Title :
57th Electronic Components & Technology Conference
fDate :
May 29 2007-June 1 2007
Abstract :
The following topics are dealt with: flip chips; IC interconnections; board level reliability; thermal mechanical loading; radiofrequency components; lead free materials; 3D packaging; copper low k; embedded devices; nanotechnology; advanced substrates; shock vibrations; creep; wafer level packaging; silicon interconnect; solder; microoptical component packaging; radiofrequency modules; polymer composites; MEMS packaging; optical interconnects; system in packaging; package on package; chip scale packaging; bump reliability; electromigration; bioelectronics; flexible electronics.
Keywords :
chip scale packaging; electromigration; flexible electronics; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; low-k dielectric thin films; micromechanical devices; nanotechnology; optical interconnections; soldering; solders; system-in-package; wafer level packaging; 3D packaging; MEMS packaging; advanced substrates; bioelectronics; board level reliability; bump reliability; chip scale packaging; copper low k; creep; electromigration; embedded devices; flexible electronics; flip chip; lead free materials; microoptical component packaging; nanotechnology; optical interconnect; package on package; polymer composites; radiofrequency components; radiofrequency modules; shock vibrations; silicon interconnect; solder; system in packaging; thermal mechanical loading; wafer level packaging;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0984-5
DOI :
10.1109/ECTC.2007.373754
