Title :
Low Cost Passive UHF RFID Packaging with Electromagnetic Band Gap (EBG) Substrate for Metal Objects
Author :
Bo Gao ; Cheng, Chi Ho ; Yuen, M.M.F. ; Murch, Ross D.
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Kowloon
fDate :
May 29 2007-June 1 2007
Abstract :
Passive UHF (Ultra High Frequency) RFID (Radio Frequency Identification) is a promising technology for products tracking in logistics or routing packages in supply chain. However, the RFID tag is significantly affected by objects surround it especially metallic objects. In this paper, we disclosed a new method using electromagnetic band gap (EBG) material to insulate the UHF RFID tag from backside objects, so that the tag could work on water surface and even metal. The design of EBG material for UHF RFID which operates at 915 MHz was discussed in this paper. An ultrathin (<1.5 mm) tag on metal with a gain of 4 dBi was achieved in simulation and a prototype of 2.93 mm thick RFID on metal tag was measured in experiment. The simulation results showed that the RFID tag still could be read on EBG substrate with a good gain (~4 dBi). The measurement results indicated that the read rang of RFID tag with EBG substrate could reach up to 4 meters on metal template.
Keywords :
UHF devices; logistics; photonic band gap; radiofrequency identification; supply chains; EBG material; electromagnetic band gap substrate; logistics; low-cost passive UHF RFID packaging; metal objects; product tracking; radiofrequency identification; supply chain; ultrathin RFID tag; Costs; Frequency; Insulation life; Logistics; Metamaterials; Packaging; Passive RFID tags; Periodic structures; RFID tags; Radiofrequency identification;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373915