DocumentCode
287978
Title
In-situ particle measurements in process equipment
Author
Smith, Lesley A. ; Boyd, Gordon ; Walton, Anthony J.
Author_Institution
Dept. of Electr. Eng., Edinburgh Univ., UK
fYear
1994
fDate
34451
Firstpage
42461
Lastpage
42467
Abstract
This paper investigates the use of In-Situ Particle Monitors (ISPM) in vacuum processing tools. In the years following their introduction the semiconductor industry has examined the relationship of ISPM data to wafer surface particle counts, or PWP. It investigates the relationship of ISPM data to other process parameters. The conclusion drawn from the analysis is that ISPM can provide a valuable source of data to aid yield prediction at an advanced step and several applications exist to use ISPM data to increase machine availability
Keywords
particle counting; semiconductor technology; surface contamination; ISPM; In-Situ Particle Monitors; PWP; in-situ particle measurements; machine availability; particles per wafer pass; process equipment; semiconductor industry; vacuum processing tools; wafer surface particle counts; yield prediction;
fLanguage
English
Publisher
iet
Conference_Titel
Semiconductor Processing - Quality through Measurement, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
367915
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