Title :
In-situ particle measurements in process equipment
Author :
Smith, Lesley A. ; Boyd, Gordon ; Walton, Anthony J.
Author_Institution :
Dept. of Electr. Eng., Edinburgh Univ., UK
Abstract :
This paper investigates the use of In-Situ Particle Monitors (ISPM) in vacuum processing tools. In the years following their introduction the semiconductor industry has examined the relationship of ISPM data to wafer surface particle counts, or PWP. It investigates the relationship of ISPM data to other process parameters. The conclusion drawn from the analysis is that ISPM can provide a valuable source of data to aid yield prediction at an advanced step and several applications exist to use ISPM data to increase machine availability
Keywords :
particle counting; semiconductor technology; surface contamination; ISPM; In-Situ Particle Monitors; PWP; in-situ particle measurements; machine availability; particles per wafer pass; process equipment; semiconductor industry; vacuum processing tools; wafer surface particle counts; yield prediction;
Conference_Titel :
Semiconductor Processing - Quality through Measurement, IEE Colloquium on
Conference_Location :
London
