DocumentCode
2879804
Title
Pattern Density Methodology Using IBM Foundry Technologies
Author
Scagnelli, David ; Grant, Casey ; Carrig, Keith ; Kemerer, Tim ; Landis, Howard ; McDevitt, Tom ; Sucharitaves, Jeanne-Tania ; Tsai, Esther ; Kumar, Mukesh ; Pastel, Paul
Author_Institution
IBM Microelectron., Essex
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1300
Lastpage
1307
Abstract
An overview of important pattern density requirements and tradeoffs for advanced RF, analog and digital technologies is presented. This paper reviews process sensitivities to pattern density, the advantage of pattern density compliant designs, performance and modeling considerations, and presents methods of detecting and enhancing pattern density deficiencies to improve overall manufacturability.
Keywords
integrated circuit manufacture; manufacturing processes; IBM foundry technologies; RF technologies; analog technologies; chemical mechanical polishing; digital technologies; manufacturability; pattern density methodology; process sensitivity; Chemical processes; Chemical technology; Condition monitoring; Foundries; Manufacturing processes; Optical microscopy; Optical sensors; Pulp manufacturing; Shape; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373963
Filename
4250049
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