• DocumentCode
    2882033
  • Title

    W-band on wafer measurement of active and passive devices

  • Author

    Edgar, D.L. ; Elgaid, K. ; Williamson, F. ; Ross, A. ; McLelland, H. ; Ferguson, Stacey ; Doherty, F. ; Thayne, I.G. ; Taylor, M.R.S. ; Beaumont, S.P.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Glasgow Univ., UK
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    42401
  • Lastpage
    42406
  • Abstract
    In this paper we have presented a study of the effect of back-thinning standard CPW wafers and the influence on measured W-band performance. Improvements in measured insertion loss and substrate cross-talk have been observed, and a study of the effect of a quartz spacer layer has been made. Additionally, the improvement in measured performance of active devices after wafer thinning has also been shown, and further progress is expected in this area
  • Keywords
    millimetre wave measurement; CPW wafer thinning; W-band on-wafer measurement; active device; insertion loss; passive device; quartz spacer layer; substrate crosstalk;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Microwave Measurements: Current Techniques and Trends (Ref. No. 1999/008), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19990025
  • Filename
    771828